23. August 2018 | Planegg

New Flash programmable audio platform from Qualcomm



  • Bluetooth 5.0
  • Bluetooth technology: Dual-mode Bluetooth
  • Audio technology: Qualcomm® cVc™ Audio technology, Qualcomm TrueWireless™ technology
  • MCU clock speed: 80MHz
  • Flash memory: Up to 64 MB external flash
  • Supported interfaces: USB 2.0, USB 3.0, I²S, SPDIF
  • Package type: WLCSP, BGA
  • Package size: 0.5mm Pitch, 3.9 x 3.6 x 0.6mm², 5.5 x 5.5 x 1 mm²

The QCC3xxx family from Qualcomm Technologies Inc., is an Audio System on Chip (SoC) solution for Entry-level.

The QCC3xxx family includes eight SoC devices – five (QCC3001 – QCC3005) which support Bluetooth headset applications, and three (QCC3006 – QCC3008) for Bluetooth speaker applications. It is very attractive for high-performance Bluetooth speaker, Bluetooth headphones as well as Bluetooth headsets of the latest generation.

Coupled with the audio development kit (ADK) and tools, these devices provide a flexible platform for designing high quality Bluetooth audio products.

The Flash programmable entry-level audio platform supports comprehensive features that enable a requirement specific application as well as a customized modification. OEMs can produce unique products for different market segments in which there only fixed-functionality ROM devices were still used.

The QCC3xxx family is designed to provide consumers with access to advanced technologies at some of the most affordable price points for listening devices, including features such as Qualcomm ® aptXTM audio and Qualcomm® cVcTM noise cancellation technology and enhanced Qualcomm TrueWirelessTM Stereo.


  • High-performance Bluetooth speaker
  • Bluetooth headphones and
  • Bluetooth headsets of the latest generation