Serial Flash and EEPROM Memory IC's
BCD Atlantik is an authorized distributor of products from Puya Semiconductor, a speciality memory IC company focussed on IoT memory.
As a technology innovator, Puya leverages state-of-the-art design and process advantage with leading foundries to
develop 28-55nm high performance and high reliability SPI flash memories for conventional consumer, industrial markets
and automotive as well as emerging applications. The IoT Flash? Family, with wide voltage and low power, is an excellent
solution for IoT and NB-IoT, Bluetooth, PLC, Wearable and Portable, 3D-CCM, AMOLED, TDDI, etc. Additionally, with
very competitive die size and performance advantage the flash memories are also ideal for MCP of SOC and MCU.
In parallel, Puya promoted 130nm non-volatile IIC EEPROM from 2kb to 1Mb with industry leading 4-million cycling,
6000V ESD protection and low power consumption both for active and standby modes, which are widely used in smart grid,
automotive, industry control and IoT applications.
Our Portfolio
FLASH
- SPI NOR Flash
EEPROM
- IIC EEPROM
Analog
- VCM Driver
Known Good Die (KGD)
- SPI NOR Flash
- IIC EEPROM
Wafer-Level Chip Scale Package (WLCSP)
- SPI NOR Flash
- IIC EEPROM
SPI NOR Flash
As technology innovator in SPI NOR Flash, Puya dedicates itself to developing distinctive SPI NOR Flash memory to meet the requirements of high performance, reliable quality and small form factor. P25Q IoT Flash? family features ultra-low power consumption and wide range Vcc, enabling extended battery life.
IIC EEPROM
With the aid of leading 130nm-shrink process platform, Puya developed competitive die size, high performance & high reliability EEPROM products, which are widely used in STB, network devices, communications, mobile phone, IP-Camera, smart meter, automotive, etc.
After six years of development, Puya has formed an abundant product lineup of IIC EEPROM, with different capacities and form factors. The highlight of Puya IIC EEPROM is its super long data retention property, which can reach 200 years.
Known Good Die (KGD)
Known Good Die (KGD) product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement.
Wafer-Level Chip Scale Package (WLCSP)
Wafer-Level Chip Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options. The die size of Puya products has leading competitiveness, so Puya WLCSP is a true chip-scale package.
